Department DEE - Academic Staff
Title Microsystems Packaging Roadmap For Next Generation Wireless Receivers
Type Conference
Name of Publisher Proceedings of the 5th WSEAS Int. Conf. on Instrumentation, Measurement, Circuits and Systems, Hangzhou, China
Publication Year 2006
First Author Yasar Amin
Second Author A. Ali
Third Author M. Zafrullah
Publication Level Research
Volume &2006
Publication Number 1
Page Number
Submitted By M Zafrullah